
( Brand: Chip Quik ), ( Manufacturer Part Number: TS391AX10 ), ( Part Type: Solder Paste Syringe ), ( UPC: 700254126784 ), ( Package Dimensions Lxwxh: 5.47x2.52x0.87 Inches ), ( Weight: 0.12 Pounds )
Product Description: Chip Quik TS391AX10 Thermally Stable Solder Paste is a high-performance, lead-free solder paste specifically designed for surface mount electronics assembly. This solder paste is formulated with the SN63/PB37 alloy and conforms to the IPC J-STD-005 standard for printed solderability and the RoHS directive for lead-free electronics.
The TS391AX10 solder paste provides excellent thermal stability, ensuring consistent joint formation even under extreme temperature cycling conditions, making it ideal for high-reliability applications. Its no-clean formulation eliminates the need for post-soldering cleaning processes, reducing production costs and improving throughput.
The solder paste's low-viscosity, tack-free formulation allows for easy printing and stencil lifetime, ensuring precise placement of solder onto the PCB pads. It offers a high-solids content, providing a robust solder joint with excellent wetting and void reduction characteristics.
The Chip Quik TS391AX10 Solder Paste comes in a 35g syringe, convenient for easy dispensing and storage. With its superior performance and versatility, this solder paste is an excellent choice for a wide range of electronic assembly applications, from consumer electronics to automotive and aerospace industries.
Pros of Buying Chip Quik Ts391AX10 Thermally Stable Solder Paste:1. No-Clean Formula: This solder paste does not require a cleaning process after soldering, saving time and resources.
2. Thermally Stable: The Ts391AX10 is designed to withstand high reflow temperatures, making it suitable for various electronics applications.
3. Sn63/Pb37 alloy: This alloy provides a good balance between the properties of tin and lead, resulting in a solder joint with good mechanical properties and wetting characteristics.
4. T4 melting point: The T4 melting point of this solder paste is suitable for many common electronics components, including BGA, CSP, and QFP packages.
5. 35g Syringe: The syringe packaging allows for precise application of the solder paste, reducing waste and promoting efficient use.
Cons of Buying Chip Quik Ts391AX10 Thermally Stable Solder Paste:1. Lead Content: Although the lead content is lower than traditional lead-based solders, it is still higher than lead-free alternatives, which may be a concern for some users.
2. Price: Compared to some lead-free solder pastes, the Chip Quik Ts391AX10 may be more expensive.
3. Availability: Depending on your location, it may be difficult to find this specific product, making it challenging to source and replenish supplies.
Conclusion:The Chip Quik Ts391AX10 Thermally Stable Solder Paste offers several advantages, such as its no-clean formula, thermally stable properties, and precise syringe packaging. However, it is important to consider the lead content and potential availability issues before making a purchase. If these factors are not a concern for your application, this solder paste could be a good choice.
Recommendation:If you are looking for a lead-free alternative, you may want to consider a solder paste like the Indium Corporation's DQ-SN100A. This lead-free solder paste is RoHS compliant and has comparable properties to the Chip Quik Ts391AX10. However, it is essential to evaluate multiple solder pastes to find the one that best fits your specific application and requirements.
Solder Paste.