SOPAGRE MN-008 Welding High Temperature Lead Clean 7445041368307 SN99/AG0.3/CU0.7 PASTE217

( Brand: Sopagre ), ( Manufacturer Part Number: MN-008 ), ( Batteries Required : No ), ( Power Source: Nk ), ( Item Weight: 3.2 Ounces ), ( Included Components: 1 Set Solder Paste ), ( Package Dimensions: 6.65 X 4.13 X 1.65 Inches ), ( UPC: 445041368307 )

Review SOPAGRE Sn99/ag0.3/cu0.7 Smd Welding High Temperature Lead free No Clean Sold

The **Sopagre MN-008 (SN99/Ag0.3/Cu0.7) Welding Paste 217 High-Temperature Lead-Free Clean** is a high-performance, no-clean solder paste specifically engineered for demanding applications requiring exceptional reliability, thermal endurance, and electrical conductivity. Formulated with a **99% tin (Sn) alloy matrix** reinforced with **0.3% silver (Ag) and 0.7% copper (Cu)**, this paste delivers an optimal balance of mechanical strength, corrosion resistance, and solder joint integrity, making it ideal for high-temperature environments where traditional lead-based pastes would fail. The **lead-free composition** adheres to stringent industry standards such as **RoHS (Restriction of Hazardous Substances Directive)** and **J-STD-005**, ensuring compliance with environmental regulations while maintaining superior wetting properties and flux activity. Designed for **wave soldering, reflow soldering, and selective soldering processes**, this paste exhibits an exceptionally **low residual flux content**, minimizing the risk of post-soldering corrosion, electrical shorts, or reliability issues in critical components like automotive electronics, aerospace connectors, power modules, and high-reliability industrial assemblies. Its **high-temperature resistance** capable of withstanding continuous operating temperatures up to **217 C (423 F)** ensures long-term stability in demanding thermal cycles, thermal shock conditions, and high-power applications where conventional solders may degrade or fail prematurely. The **fine particle distribution and optimized viscosity** of the paste facilitate precise stenciling and consistent deposition, reducing defects such as bridging, insufficient wetting, or void formation in fine-pitch and micro-BGA soldering. Additionally, its **no-clean formulation** eliminates the need for post-soldering cleaning processes, streamlining production workflows while maintaining cleanliness in sensitive electronic assemblies. Whether used in **high-speed computing, automotive infotainment systems, or renewable energy infrastructure**, this solder paste provides a robust, lead-free solution that enhances solder joint durability, electrical performance, and overall system reliability in the most challenging operating environments.

**Pros and Cons of Buying SOPAGRE MN-008 (SN99/Ag0.3/Cu0.7) High-Temperature Lead-Free Welding Paste (217 C)**

1. **Lead-Free Composition** Complies with environmental regulations (RoHS, REACH) and reduces health risks associated with lead exposure, making it safer for both users and the environment.

2. **High-Temperature Performance** Operates effectively at temperatures up to **217 C**, suitable for applications requiring robust solder joints in demanding environments (e.g., automotive, aerospace, or high-power electronics).

3. **Silver-Copper Alloy (Ag0.3/Cu0.7)** The alloy composition enhances electrical and thermal conductivity, improving joint reliability and performance in high-stress applications.

4. **Low Residue Content** Minimizes post-welding cleaning requirements, reducing processing time and potential corrosion risks.

5. **Stable Wetting Properties** Ensures consistent solder flow and adhesion, reducing defects in manufacturing processes.

6. **Long Shelf Life** Properly stored, the paste maintains its properties over extended periods, reducing waste from expired materials.

7. **Compatibility with Various Substrates** Works well with copper, nickel, and other common PCB materials, expanding its usability in different applications.

8. **Industrial-Grade Quality** Manufactured by SOPAGRE, a reputable brand known for precision and reliability in soldering materials.

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1. **Higher Cost** Lead-free and high-performance solder pastes are generally more expensive than traditional tin-lead alternatives, increasing material costs.

2. **Slightly Higher Melting Point** The **217 C** melting point may require adjustments in reflow oven profiles compared to standard lead-based solders (typically 183 C), potentially increasing energy consumption.

3. **Potential for Oxidation** Silver and copper can oxidize if not stored properly, affecting performance. Requires careful handling and storage (e.g., nitrogen-purged containers).

4. **Limited Availability of Specialized Tools** Some older or niche equipment may not be optimized for high-temperature lead-free soldering, requiring additional investment in compatible tools.

5. **Potential for Intermetallic Compound Formation** Prolonged exposure to high temperatures may lead to brittle intermetallic layers, though this is mitigated by proper process control.

6. **Sensitivity to Contamination** Like all solder pastes, it is susceptible to moisture, dust, or flux residue contamination, which can degrade performance if not managed.

7. **Learning Curve for New Users** Operators unfamiliar with lead-free or high-temperature soldering may require training to achieve optimal results.

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The **SOPAGRE MN-008 (SN99/Ag0.3/Cu0.7) high-temperature lead-free welding paste** is an excellent choice for applications demanding **reliability, environmental compliance, and high-performance solder joints**. Its **superior conductivity, stability, and lead-free safety** make it ideal for industries where traditional solders fall short. However, the **higher cost, temperature sensitivity, and storage requirements** may pose challenges for budget-conscious or small-scale operations.

For **automotive, aerospace, high-power electronics, or any application requiring solder joints under thermal or electrical stress**, this paste is strongly recommended. For **general electronics assembly or cost-sensitive projects**, a lower-temperature lead-free paste (e.g., SAC305) may be more practical.

If your project **requires high-temperature resistance, lead-free compliance, and long-term reliability**, the **SOPAGRE MN-008 is a superior investment**. Ensure proper storage, equipment calibration, and operator training to maximize its benefits. For standard applications, weigh the cost against alternatives before committing.

Details:

Paste Features: Lead-Free Solder - Low Temperature With Flux, Melting Point: 218 C.: Lead-Free Solder Paste Content: Alloy Tin 99% Ag 0.3 Cu0.7%, Flux 10.5%. Paste Features: Lead-Free, No Clean, Strong Viscosity, Bright Welding Point. Package Includes: A Bottle of Solder Paste.

Applications: Widely Used in Circuit Board, LC, BGA /SMD Board,Motors, Lighting,TV and Other Household Appliances And industrial Equipment,Sensors, Wires, Fuses, Phone,Metal Shells, Motors,Lighting, connectors,SMT Maintenance.

part #: mn008 price

• $20.23

specifications weldtoolsam:

• brand: Sopagre
• mpn: Mn-008
• batteries required : No
• power source: Nk
• item weight: 3.2 Ounces
• included components: 1 Set Solder Paste
• package dimensions: 6.65 X 4.13 X 1.65 Inches
• upc: 445041368307

offer weldtoolsam:

• options: Ship-to-home
• sold: 0
• quantity: 1
• availability: In Stock
• started: May 30, 2026

seller weldtoolsam:

• city: Cherry Hill, New Jersey
• rating: 100.0%
• # reviews: 707

general weldtoolsam:

• condition: New
• Tools Workshop Equipment > Power Tools > Welding Soldering Tools

payments weldtoolsam:

• other
• wallet: Google-pay
• credit card: Mastercard

returns weldtoolsam:

• policy: Returns Accepted
• time: 30 Days
• paid by: Seller
• method: Money back

shipping weldtoolsam:

• class: Expedited
• transit: 4-7 Days
• service: Expedited
• type: Fixed
• cost: $0.00

Sopagre MN-008 Is Similar To:

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