KOOINGTECH BALL820 Bga Tin Solder Ball Bottles Reballing Fo 7445020475439 0.3-0.76MM Stencils Bead

( Brand: Kooingtech ), ( Manufacturer Part Number: BALL820 ), ( Model: TIN SOLDER BALL820 ), ( Batteries Required : No ), ( Item Weight: 4.8 Ounces ), ( Included Components: Tin Solder Ball ), ( Package Dimensions: 4.1 X 2 X 2 Inches ), ( UPC: 445020475439 )

Review KOOINGTECH Bga Tin Solder Ball Bottles 0.3-0.76mm Reballing Stencils Bead Fo

KOOINGTECH 445020475439 BGA Tin Solder Ball Bottles 0.3-0.76mm Reballing Stencils for Precision Bead Floading

Experience unparalleled precision and reliability in your BGA reballing processes with the KOOINGTECH 445020475439 BGA Tin Solder Ball Bottles. These reballing stencils offer an exceptional solution for professionals seeking high-quality, durable, and consistent results.

Crafted with meticulous attention to detail, these stencils are designed to accommodate BGA balls with sizes ranging from 0.3mm to 0.76mm. This versatility ensures that they can be used in a wide range of applications, making them an indispensable tool for both novice and seasoned technicians.

The KOOINGTECH BGA Tin Solder Ball Bottles are manufactured with superior quality materials, ensuring longevity and durability. The stencils are made of a sturdy, corrosion-resistant material that can withstand repeated use and harsh conditions, providing long-lasting performance.

Each bottle contains a large number of BGA balls, ensuring that you have enough for multiple reballing jobs. The balls are precision-manufactured to ensure consistency in size and shape, ensuring optimal contact with the BGA pads and a strong, reliable joint.

The KOOINGTECH 445020475439 BGA Tin Solder Ball Bottles are designed with a bead foil system, allowing for easy and precise application of the solder balls. The bead foil is highly adhesive, ensuring that the balls stay in place during the reballing process, and can be easily removed after the process is complete.

In summary, the KOOINGTECH 445020475439 BGA Tin Solder Ball Bottles are a must-have tool for any electronics technician. With their versatile size range, high-quality materials, and precision bead foil system, they offer a reliable, consistent, and efficient solution for BGA reballing jobs. Invest in these stencils today and elevate your reballing processes to new heights of precision and reliability.

Pros and Cons of Purchasing Kooingtech BGA Tin Solder Ball Bottles for Reballing Stencils (Model: 445020475439)

1. Versatility: The solder balls in various sizes (0.3-0.76mm) cater to a wide range of BGA components, making it a suitable choice for multiple electronic devices.

2. Quality: Kooingtech is a recognized brand in the electronics industry, promising high-quality products.

3. Economical: The solder ball bottles are cost-effective compared to individual solder balls, offering value for money.

4. Convenience: The convenient packaging allows for easy storage and use, especially in a repair shop or a DIY setup.

1. Size Limitations: While the solder balls are available in multiple sizes, they may not perfectly match the original solder ball sizes of some devices, potentially affecting the quality of the reballing process.

2. Potential Waste: Since the solder balls are sold in bottles, there's a risk of wasting unused solder balls if the project requires fewer balls than the quantity provided.

3. Learning Curve: Reballing BGA components requires skill and precision, and these solder balls are intended for professionals or experienced DIYers.

The Kooingtech 445020475439 BGA Tin Solder Ball Bottles offer a cost-effective solution for reballing stencils, catering to a wide range of BGA components. However, their suitability depends on the user's skill level and the precision required for the specific BGA components being reballed. For professionals or experienced DIYers, these solder balls can be a valuable addition to their toolkit. For beginners, it may be beneficial to gain some experience with reballing before investing in these solder balls to minimize potential waste and ensure high-quality results.

Details:

BGA Tin Solder Ball, 9 Bottles 0.3-0.76Mm Reballing Stencils, Bead for PCB Board GPU CPU IC Chip Circuit Module:: Item model number tin solder BALL820, Batteries required. Features: These tin balls are used for connection of semiconductor chip, circuit module and PCB board. Easy to Operate: Reballing stencils operation is simple, can be directly welded, suitable for PCB board GPU CPU IC chip circuit module connection. Tips: The larger the BGA solder ball model, particles, more in bottle, on contrary, smaller less 0.76mm is full bottle.

Product specifications: Each bottle contains about 25,000 tin solder balls, 0.3-0.76mm, including 9 sizes, to meet your basic welding needs, with good practicability. Function: Reballing stencils to connect semiconductor wafers and circuit template machine PCB board, transmit electronic ultra small tin parts. They are quite small and can transmit electronic. No, Power Source no, Item Weight 4.8 ounces, Included Components tin solder ball, Package Dimensions 4.1 x 2 inches, Manufacturer KooingTech.

specifications weldtoolsam:

• brand: Kooingtech
• mpn: Ball820
• model: Tin Solder Ball820
• batteries required : No
• item weight: 4.8 Ounces
• included components: Tin Solder Ball
• package dimensions: 4.1 X 2 X 2 Inches
• upc: 445020475439

shipping weldtoolsam:

• transit: 5-11 Days
• class: Standard
• cost: $0.00
• service: Standard
• type: Fixed

returns weldtoolsam:

• method: Money back
• paid by: Seller
• time: 30 Days
• policy: Returns Accepted

seller weldtoolsam:

• # reviews: 0
• rating: 0.0%
• city: Denver, Colorado

payments weldtoolsam:

• other
• credit card: Visa
• wallet: Apple-pay

offer weldtoolsam:

• options: Ship-to-home
• started: January 15, 2026
• availability: In Stock
• sold: 0
• quantity: 1

general weldtoolsam:

• Tools Workshop Equipment > Power Tools > Welding Soldering Tools
• condition: New